March 24, 2025
Metrology for hybrid bonds, microbumps and TSVs in advanced packaging – are X-ray methods up to the task?
Julius Hållstedt, Excillum, talks about how high-resolution X-ray methods will become increasingly important to support…
March 4, 2025
Excillum launches MetalJet F1016
March 4, 2025 - MetalJet F1016 combines unparalleled speed, precision and versatility to meet the…
October 28, 2024
Excillum wins E-Mobility Process Innovation award
October 28, 2024 - The E-Mobility Production Awards recognize players who are producing promising approaches…
July 8, 2024
Excillum and TechValley secure first project to provide extreme resolution X-ray inspection of electronics
July 8, 2024 - Excillum and TechValley announce that they have formed a partnership and…
June 16, 2024
High resolution non-destructive nano-CT of 3D package
Investigation of a 3D package with hollow core through package vias (TPV) and 3D redistribution…
June 15, 2024
Hybrid bonds
A commercially available AMD Ryzen 7 5800X3D was investigated. This device assembly utilizes hybrid bonds…
June 14, 2024
Multi-layer ceramic capacitors (MLCC)
By utilizing the Excillum NanoTube N3 in a nanoCT (3D X-ray) setup it is possible…
June 13, 2024
Extreme resolution 3D X-ray for advanced packaging
A commercial GPU with HBM is analysed using the Excillum NanoTube N3 X-ray source in…
April 24, 2024
Sharper scans, faster ramp-up
How a leap forward in X-ray resolution can drive development and boost yield in advanced…
