April 11, 2025
Fast and high-resolution X-ray nano tomography for failure analysis in advanced packaging
Till Dreier, Daniel Nilsson and Julius Hållstedt Science Direct, Microelectronics Reliability, Volume 168, May 2025,…
March 24, 2025
Metrology for hybrid bonds, microbumps and TSVs in advanced packaging – are X-ray methods up to the task?
Julius Hållstedt, Excillum, talks about how high-resolution X-ray methods will become increasingly important to support…
October 28, 2024
Excillum wins E-Mobility Process Innovation award
October 28, 2024 - The E-Mobility Production Awards recognize players who are producing promising approaches…
July 8, 2024
Excillum and TechValley secure first project to provide extreme resolution X-ray inspection of electronics
July 8, 2024 - Excillum and TechValley announce that they have formed a partnership and…
June 16, 2024
High resolution non-destructive nano-CT of 3D package
Investigation of a 3D package with hollow core through package vias (TPV) and 3D redistribution…
June 15, 2024
Hybrid bonds
A commercially available AMD Ryzen 7 5800X3D was investigated. This device assembly utilizes hybrid bonds…
June 14, 2024
Multi-layer ceramic capacitors (MLCC)
By utilizing the Excillum NanoTube N3 in a nanoCT (3D X-ray) setup it is possible…
June 13, 2024
Extreme resolution 3D X-ray for advanced packaging
A commercial GPU with HBM is analysed using the Excillum NanoTube N3 X-ray source in…
April 24, 2024
Sharper scans, faster ramp-up
How a leap forward in X-ray resolution can drive development and boost yield in advanced…
