Complex architectures with intricate interconnects, stacked dies, and buried features – the recent developments in advanced packaging come with great possibilities but also challenges. From off-line Failure Analysis (FA) to at- and in-line inspection in manufacturing — more efficient and higher resolution methods are needed to accelerate development and improve yield. X-ray nano-computed tomography (nano-CT) addresses this challenge by offering 3D imaging for e.g. Failure Analysis with sub-micron resolution, enabling precise visualization of internal structures such as micro-bumps, TSVs, bond lines, and voids.
