Date(s) - 10月 13, 2020 - 10月 30, 2020
The 17th International Wafer-Level Packaging Conference.
Live Virtual Exposition: October 13-14
On-Demand Conference & Expo: October 13-30
Make sure not to miss out on Keith Bryant’s talk on “New X-ray tubes for Wafer-Level Inspection” in the technical program.