Date(s) - 10月 13, 2020 - 10月 30, 2020

The 17th International Wafer-Level Packaging Conference.

Live Virtual Exposition: October 13-14
On-Demand Conference & Expo: October 13-30

Make sure not to miss out on Keith Bryant’s talk on “New X-ray tubes for Wafer-Level Inspection” in the technical program.

Read more about the event here.


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